Road to Chiplets – Data & Test

Road Chiplets – Data Test on  November 9 – 11, 2021

Data sharing and analysis of test results and other production ‘signals’ are critical enabling technologies
to make Chiplet-based advanced packaging practical. To transition Chiplets from design of experiments and prototypes to commercial reality
will require cross-functional data sharing across factories and suppliers. New data sources including new
test steps and new ways of analyzing and sharing data are essential.

We will explore the new types of data and tests required to make products using a Chiplet
approach practical at Road to Chiplets – Data & Test.

Authors on November 11th 2021 to be announced

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Too Hot to Test 2021

February 9-11, 2021 – Online

As the industry moves to develop creative artificial intelligence (AI) and other advanced computing devices, the power consumption per semiconductor device has skyrocketed. This brings with it challenges in power deliver as well as device cooling. The virtual workshop Too Hot to Test will explore the cross-functional challenges associated with testing high-power devices. The focus will be on chips, die stacks, and multi-chip modules from both a thermal and power perspective.

Join us to learn what is possible and when a device really becomes Too Hot to Test!

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Known Good Die Workshop 2020

September 16 – 18, 2020 – 20th annual

With the demise of Moore’s Law due to the economics of advanced semiconductor process nodes, the demand for greater cost performance and differentiation has fueled the development of advanced packaging. Having Known Good Die (KGD) is essential for many, if not all, of the current ‘crop’ of advanced semiconductor packaging.

Join us at the Known Good Die Workshop for a cross-functional view of challenges and solutions for achieving KGD!