The semiconductor industry has come a long way from the days where the semiconductor die design / layout team simply passed the device off to another team to “handle” the packaging. Now there are packaging Design Integration (DI) teams who are responsible for “co-designing” the packaging and other processing while the chip is being designed. These teams resolve interdependencies, develop test vehicles, and manage risk to make sure there is a viable product.
Heterogeneous Integration (HI) of multiple semiconductor dies of different designs in a single advanced package to increase functionality has become commonplace. HI provides significant challenges to assembly and test today, and is Design Integration really ready to efficiently deal with HI? Especially as “Chiplets” - integrating an even larger number of die each smaller than a complete ‘standalone’ semiconductor device in a single package – gain traction these challenges will become even harder. Instead of a single digit number of die, assembly and test will need to accommodate tens of Chiplet die in each package.
As part of the MEPTEC Road to Chiplets series, we will discuss the role and challenges of DI in the upcoming storm of Chiplets. Properly implementing and developing methodologies to manage DI is essential to make Chiplets commercially viable.
Road Chiplets - Design Integration
May 10 - 12, 2022
|Tuesday||May 10, 2022||8:00 - 11:00 am PDT|
|Wednesday||May 11, 2022||8:00 - 11:00 am PDT|
|Thursday||May 12, 2022||8:00 - 11:00 am PDT|
Confirmed Speakers Include
Tuesday May 10, 2022
Wednesday May 11, 2022
Thursday May 12, 2022
Substrate Design Optimization for Chiplet Architecture
Universal Chiplet Interconnect Express (UCIe)
Debendra Das Sharma
Design Integration : Current Status and Future Directions
ASE is the global leader in advanced semiconductor packaging & test, and at the forefront of flexible, powerful integration technologies that achieve criteria for improved power, performance, area, and cost requirements. Our comprehensive toolbox leveraging innovative technologies, such as die interconnection, wafer level fan out, embedded devices, conformal and compartmental shielding, integrated antenna, and others, are constantly being refined and enhanced to support next generations of system integration.
ASE believes that innovation is everything. Our industry is driven by innovation, and through ASE's integration and miniaturization technologies, we are enabling transformative solutions that are changing lives, from health to transportation, from Robotics to AI, from IoT to 5G. ASE is proud to be part of these advancements and we look forward to working with you to create a smarter and more sustainable world.
You are cordially invited to learn about more about how we can help enable and collaborate in your innovation: please contact Patricia MacLeod