Road to Chiplets – Design Integration

The semiconductor industry has come a long way from the days where the semiconductor die design / layout team simply passed the device off to another team to “handle” the packaging. Now there are packaging Design Integration (DI) teams who are responsible for “co-designing” the packaging and other processing while the chip is being designed. These teams resolve interdependencies, develop test vehicles, and manage risk to make sure there is a viable product.

Heterogeneous Integration (HI) of multiple semiconductor dies of different designs in a single advanced package to increase functionality has become commonplace. HI provides significant challenges to assembly and test today, and is Design Integration really ready to efficiently deal with HI? Especially as “Chiplets” - integrating an even larger number of die each smaller than a complete ‘standalone’ semiconductor device in a single package – gain traction these challenges will become even harder. Instead of a single digit number of die, assembly and test will need to accommodate tens of Chiplet die in each package.

As part of the MEPTEC Road to Chiplets series, we will discuss the role and challenges of DI in the upcoming storm of Chiplets. Properly implementing and developing methodologies to manage DI is essential to make Chiplets commercially viable.

Road Chiplets - Design Integration
May 10 - 12, 2022

Register Here

Held as three online sessions
Tuesday May 10, 2022 8:00 - 11:00 am PDT
Wednesday May 11, 2022 8:00 - 11:00 am PDT
Thursday May 12, 2022 8:00 - 11:00 am PDT

Confirmed Speakers Include

Tuesday May 10, 2022

Lalitha Immaneni
Heterogeneous Integration:
The Role of Design in Putting the Pieces Together

Sujit Sharan

John Park
Design Challenges for 3D-ICs

John Park

Amy Lujan
Cost and Yield Analysis of Chiplet Packaging

Amy Lujan

Marc Swinnen
Kenneth Larsen
Successful 3DIC Multi-Die Silicon System Design Using Synopsys 3DIC and Ansys Multiphysics Analysis

Marc Swinnen - Ansys
Kenneth Larsen - Synopsys

Wednesday May 11, 2022

Thomas To
Systematic Identification of Key Design Factors for Chiplet Eco System Enabling

Thomas To

Steve Groothuis
Silicon Photonics Chiplet - Managing Design Integration

Steve Groothuis

Lihong Cao
Advanced Packaging Design Platform and Assembly Design Kit for Chiplets and Heterogeneous Integration

Lihong Cao

Thursday May 12, 2022

Deepak Kulkarni
Substrate Design Optimization for Chiplet Architecture

Deepak Kulkarni

Debendra Das Sharma
Universal Chiplet Interconnect Express (UCIe)

Debendra Das Sharma


Design Integration : Current Status and Future Directions


Sponsor Directory

Please thank our sponsors who have made this event possible!

Emerald Sponsors

Advantest logo
Advantest is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, artificial intelligence (AI), machine learning, smart medical devices and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also conducts R&D to address emerging testing challenges, produces multi-vision metrology scanning electron microscopes essential to photomask manufacturing, and offers groundbreaking 3D imaging and analysis tools. Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility.
ASE Group Logo

ASE is the global leader in advanced semiconductor packaging & test, and at the forefront of flexible, powerful integration technologies that achieve criteria for improved power, performance, area, and cost requirements. Our comprehensive toolbox leveraging innovative technologies, such as die interconnection, wafer level fan out, embedded devices, conformal and compartmental shielding, integrated antenna, and others, are constantly being refined and enhanced to support next generations of system integration.

ASE believes that innovation is everything. Our industry is driven by innovation, and through ASE's integration and miniaturization technologies, we are enabling transformative solutions that are changing lives, from health to transportation, from Robotics to AI, from IoT to 5G. ASE is proud to be part of these advancements and we look forward to working with you to create a smarter and more sustainable world.

You are cordially invited to learn about more about how we can help enable and collaborate in your innovation: please contact Patricia MacLeod