July 13-14, 2021 – Online
The concept of “Chiplets” – integrating multiple die smaller than complete “stand alone” semiconductor devices using advanced packaging – has firmly captured the attention of the semiconductor industry. The foundational technologies to enable this advanced packaging have been explored in detailed at industry events. MEPTEC through a series of events will cover the practical aspects of designing, implementing (packaging), and testing Chiplets as this cross-functional knowledge is critical to transitioning such devices from science projects to commercial reality.
Join us as we focus on the high-level decisions that need to be made to implement a product using a Chiplet approach.