April 4 – 6, 2023 – Online
Today advanced semiconductor packaging is already delivering Heterogeneous Integration (HI) by
enabling the mix-n-matching of integrated circuits (typically known good die) in the same package to
deliver higher performance. However, HI also includes the concept of assembling elements beyond
integrated circuits, such as optical elements or various sensors including micro-electromechanical
systems (MEMS), in devices and products.
The largest challenges discussed to date have been focused on the integrated circuits. This workshop will
explore the challenge associated with everything other than the chips which are pulled together to make
today’s leading-edge heterogeneous integrations a reality.