Road to Chiplets – Ecosystems 2023

November 29, 2023

With heterogeneous integration (HI) and advanced packaging becoming the dominant drivers of progress in many electronic products, the need for collaboration and a robust ecosystem has grown. In the earlier days of Moore’s Law when the silicon node was the main metric and driver for advances in the semiconductor industry, the International Technology Roadmap for Semiconductors (ITRS) was the primary vehicle for coordinating these activities.

Now, though, there is no single metric specifying the details and timing for progress enabled by integration technologies, so new approaches are needed. There have been road mapping efforts that have laid much of the groundwork, such as the Heterogeneous Integration Roadmap (HIR), but more work is needed to have such efforts fully embedded in the industry’s path forward. Similarly, there are various interconnect standards emerging, such as UCIe, but with more (and more complicated) integration scenarios, these standards cover only a fraction of what’s needed.