February 9-11, 2021 – Online
As the industry moves to develop creative artificial intelligence (AI) and other advanced computing devices, the power consumption per semiconductor device has skyrocketed. This brings with it challenges in power deliver as well as device cooling. The virtual workshop Too Hot to Test will explore the cross-functional challenges associated with testing high-power devices. The focus will be on chips, die stacks, and multi-chip modules from both a thermal and power perspective.
Join us to learn what is possible and when a device really becomes Too Hot to Test!