Road to Chiplets – Ecosystems 2023

November 29, 2023 • SEMI, Milpitas, CA

With heterogeneous integration (HI) and advanced packaging becoming the dominant drivers of progress in many electronic products, the need for collaboration and a robust ecosystem has grown. In the earlier days of Moore’s Law when the silicon node was the main metric and driver for advances in the semiconductor industry, the International Technology Roadmap for Semiconductors (ITRS) was the primary vehicle for coordinating these activities.

Now, though, there is no single metric specifying the details and timing for progress enabled by integration technologies, so new approaches are needed.  There have been road mapping efforts that have laid much of the groundwork, such as the Heterogeneous Integration Roadmap (HIR), but more work is needed to have such efforts fully embedded in the industry’s path forward.  Similarly, there are various interconnect standards emerging, such as UCIe, but with more (and more complicated) integration scenarios, these standards cover only a fraction of what’s needed.

Microelectronics Packaging and Test Engineering Council (MEPTEC is hosting an in-person symposium on Wednesday November 29, 2023 to explore the challenges faced in creating a robust HI ecosystem. We will have speakers from throughout the semiconductor industry to help answer:  What else can roadmaps do? How do we address the fundamentally different situation of heterogeneous integration compared to silicon nodes? Can we converge on a manageable set of standards, and what should be the scope of those standards?  What other collaborative mechanisms will help the ecosystem? Given the collaborative approach needed to address the challenges, MEPTEC is very pleased to be presenting this as an in-person event.  See you there!

We are soliciting exhibitors and event sponsors to support the event.
Please reach out to Rosina Haberl ( for questions or more information.

Register Here

9:00 AM


Ira Feldman
Opening Remarks

Ira Feldman
Opportunities & Challenges - in building a chiplet ecosystem

Jan Vardaman
TechSearch International

Bapi Vinnakota
Building the Open Chiplet Economy

Bapi Vinnakota

10:15 AM


10:45 AM

Session 1

ImageDick OtteDavid RatchkovMichael HerndonSamSalama
Chiplet.US: Challenges, Opportunities, and Ecosystem Partnering Examples

Jawad Nasrullah - Palo Alto Electron
Dick Otte - Promex
David Ratchkov - Thrace Systems
Michael Herndon - Epirus Inc.
Sam Salama - Hyperion Technologies


Automotive Chiplets, A Pivotal Moment

Kurt Herremans

12:15 PM


1:00 PM

Session 2

Salam Aburwein
Unleashing GPU Potential: Advanced Packaging & Heterogeneous Integration

Salam Aburwein

Lihong Cao
Advanced Packaging Design to enable Chiplets D2D Interconnect Standards

Lihong Cao

Optical I/O chiplets - market needs and ecosystem dynamics

LK Bhupathi
Ayer Labs

A chiplet based SmartNIC platform using an open die to die standard

Suresh Subramaniam

3:00 PM


3:30 PM

Session 3

Itai Leshniak

Enabling the Digital Transformation with Heterogeneous Integration: A System Perspective
Itai Leshniak

Vineet Pancholi

Production Test Ecosystem – Test Road to 3DIC Chiplet integration
Vineet Pancholi


Production Test of Chiplets & Multi-Die Systems
Bob Bartlett

5:00 PM


6:00 PM


Sponsor Directory

Please thank our sponsors who have made this event possible!

Ruby Sponsor

Advantest logo
Advantest is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G, IoT, autonomous vehicles, high-performance computing (HPC), AI and more. The company also conducts R&D to address emerging testing challenges and applications; develops advanced test-interface solutions for wafer sort and final test; produces scanning electron microscopes essential to photomask manufacturing; and offers system-level test solutions and other test-related accessories. Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility. Learn more at

ASE logo
ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. In a world running on semiconductor technology to achieve lifestyle, efficiency and sustainability goals, packaging innovation is at the heart of what ASE does. ASE today is delivering on the promise of heterogeneous integration, through advanced packaging, system-in-package, and chiplet solutions to meet growth momentum across HPC, Automotive, AI, 5G, and more. To learn about our technology advances and our VIPack™ platform that is designed to enable vertically integrated package solutions, please visit or follow us on Linkedin @aseglobal.

Exhibitor Directory

Chiplet.US offers comprehensive services encompassing chip design, simulation, and manufacturing, leveraging the integration of chiplets and heterogeneous components. Our organization represents a collaborative ecosystem founded by pioneering semiconductor and electronics companies in the United States including Palo Alto Electron, Thrace Systems, Hyperion, Epirus, Promex Industries, iTest, and Anemoi Software.  We offer pilot and volume manufacturing for substrates, 3DIC, and 3DHI devices, along with turnkey solutions available for SIP and Modules.  Connect with us at