Road to Chiplets – Data & Test

Road Chiplets – Data Test on  November 9 – 11, 2021

Data sharing and analysis of test results and other production ‘signals’ are critical enabling technologies
to make Chiplet-based advanced packaging practical. To transition Chiplets from design of experiments and prototypes to commercial reality
will require cross-functional data sharing across factories and suppliers. New data sources including new
test steps and new ways of analyzing and sharing data are essential.

We will explore the new types of data and tests required to make products using a Chiplet
approach practical at Road to Chiplets – Data & Test.

Authors on November 11th 2021 to be announced

Chiplets Architecture 2021

July 13-14, 2021 – Online

The concept of “Chiplets” – integrating multiple die smaller than complete “stand alone” semiconductor devices using advanced packaging – has firmly captured the attention of the semiconductor industry. The foundational technologies to enable this advanced packaging have been explored in detailed at industry events. MEPTEC through a series of events will cover the practical aspects of designing, implementing (packaging), and testing Chiplets as this cross-functional knowledge is critical to transitioning such devices from science projects to commercial reality.

Join us as we focus on the high-level decisions that need to be made to implement a product using a Chiplet approach.