Too Hot to Test 2021 Banner

Too Hot to Test 2021

As the industry moves to develop creative artificial intelligence (AI) and other advanced computing devices, the power consumption per semiconductor device has skyrocketed. This brings with it challenges in power deliver as well as device cooling. The virtual workshop Too Hot to Test will explore the cross-functional challenges associated with testing high-power devices. The focus will be on chips, die stacks, and multi-chip modules from both a thermal and power perspective.

Join us on February 9-11, 2021 to learn what is possible and when a device really becomes Too Hot to Test!

Held as three online sessions
Tuesday February 9, 2021 8:00 - 11:00 am PDT
Wednesday February 10, 2021 8:00 - 11:00 am PDT
Thursday February 11, 2021 8:00 - 11:00 am PDT

Event registration is free courtesy of our sponsors

Tuesday February 9, 2021
8:00 am- 11:00am

Power Requirements and Delivery

Ira Feldman
Opening Remarks

Ira Feldman
Gamal Refai-Ahmed
Keynote - Understanding Thermo-Mechanical to Maximize Si Performance

Gamal Refai

Dr. Gamal Refai-Ahmed, Life Fellow ASME, Fellow EIC, Fellow IEEE, Fellow Canadian Academy of Engineering, is Xilinx Fellow a Chief Thermo-Mechanical Architect. He obtained the Ph. D. degre in Mechanical Engineering from the University of Waterloo.

He has been recognized as one of the global technical leaders of thermal management through his numerous publications (more than 100 publications) and patents& patents pending US (more than 50) and International (more than 120). His contributions are clearly seen in several generations of both GPU and FPGA products...

Arun Krisnamoorthy
Thermal challenges during test of High Performance CPUs for client and server segments

Arun Krishnamoorthy
Optimizing Test based on Device Temperature

Ken Lanier
Dave Armstrong
Our Best-Known Methods for the Testing of High-Power ICs

David Armstrong
Adam Cron
Correlation of Low-Power Synthesis and Test Capabilities to Silicon by EDA

Adam Cron

Wednesday February 10, 2021
8:00 am- 11:00am

Thermal Needs and Requirements

David Ratchkov
System Power Modeling and Analysis for Test

David Ratchkov
Thrace Systems
David Saums
Thermal Management Materials and Technologies for Semiconductor Test

David Saums
DSA Thermal
Karan Maniar
A Revolutionary MEMS RF Hybrid Probe Card

Karan Maniar
Nidec SV TCL

Jerry Tustaniwskyj
Thermal Challenges and Methods in Semiconductor Test

Jerry Tustaniwskj

Capability - Thursday February 11, 2021
8:00 am- 11:00am

Thermal Capabilities and Solutions

Weihua Tang
Hot Packaging Solutions

Weihua Tang

Creative Cooling Techniques for Package-Level Testing

Andrei Berar
Nguyen QuynhTim Wooden

Thermal Management for IC System Level and Functional/Structuring Testing

Nguyen Quynh and Tim Wooden
Smiths Interconnect

Markus Kindler
Active Thermal Control

Markus Kindler
Formfactor / ATT

Program subject to change without notice.

Event registration is free courtesy of our sponsors

Sponsor Directory

Please thank our sponsors who have made this event possible!

Emerald Sponsors

Advantest logo
Advantest is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, artificial intelligence (AI), machine learning, smart medical devices and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also conducts R&D to address emerging testing challenges, produces multi-vision metrology scanning electron microscopes essential to photomask manufacturing, and offers groundbreaking 3D imaging and analysis tools. Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility.

Amkor Logo

Amkor Technology is one of the world’s largest providers of high-quality semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s broad package portfolio offers our customers semiconductor solutions to enable 5G, AI, Automotive, Communications, Computing, Consumer, Industrial, IoT and Networking products.

Services include package design and development, wafer probe and package test, wafer bumping and redistribution, package assembly and final test. Engineering services offer best-in-class thermal, electrical and mechanical modeling and characterization as well as design automation. Test engineering services range from test program development to full product characterization of packaged RF, mixed signal, logic and memory devices.

Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the US.

Indium Corporation Logo

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

Indium AD

Sapphire Sponsor

Nidec SVTCL logo

FormFactor is a leading provider of essential test and measurement technologies along the full IC life cycle – from metrology and inspection, characterization, modeling, reliability, and design debug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge.

FormFactor’s leading-edge probe stations, probes, probe cards, optical metrology and inspection, advanced thermal subsystems and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing of high-speed and high-density semiconductor chips. FormFactor serves customers in Asia, Europe, and North America.

Nidec SVTCL logo

Nidec SV TCL is a global provider of high-quality semiconductor testing solutions. Our extensive product line includes innovative MEMS Probes and a variety of Probe Card technologies. Our proprietary MEMS Probes are fully customizable, capable of both wafer/final test, and can be utilized for many advanced devices including RF, 5G, Mobile, Auto & IoT. We also have analytical and simulation capabilities along with full turnkey services for probe cards and final test.

Our unmatched worldwide infrastructure provides coverage for major semiconductor regions around the world with full design & manufacturing capabilities for our probe technologies in China, USA, Taiwan, Japan, Korea & Singapore.

Contact us at to learn more!