As the industry moves to develop creative artificial intelligence (AI) and other advanced computing devices, the power consumption per semiconductor device has skyrocketed. This brings with it challenges in power deliver as well as device cooling. The virtual workshop Too Hot to Test will explore the cross-functional challenges associated with testing high-power devices. The focus will be on chips, die stacks, and multi-chip modules from both a thermal and power perspective.
Join us on February 9-11, 2021 to learn what is possible and when a device really becomes Too Hot to Test!
|Tuesday||February 9, 2021||8:00 - 11:00 am PDT|
|Wednesday||February 10, 2021||8:00 - 11:00 am PDT|
|Thursday||February 11, 2021||8:00 - 11:00 am PDT|
Tuesday February 9, 2021 Power Requirements and Delivery
8:00 am- 11:00am
Keynote - Understanding Thermo-Mechanical to Maximize Si Performance
Dr. Gamal Refai-Ahmed, Life Fellow ASME, Fellow EIC, Fellow IEEE, Fellow Canadian Academy of Engineering, is Xilinx Fellow a Chief Thermo-Mechanical Architect. He obtained the Ph. D. degre in Mechanical Engineering from the University of Waterloo.
He has been recognized as one of the global technical leaders of thermal management through his numerous publications (more than 100 publications) and patents& patents pending US (more than 50) and International (more than 120). His contributions are clearly seen in several generations of both GPU and FPGA products...
Wednesday February 10, 2021 Thermal Needs and Requirements
8:00 am- 11:00am
Capability - Thursday February 11, 2021 Thermal Capabilities and Solutions
8:00 am- 11:00am
Program subject to change without notice.
Amkor Technology is one of the world’s largest providers of high-quality semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s broad package portfolio offers our customers semiconductor solutions to enable 5G, AI, Automotive, Communications, Computing, Consumer, Industrial, IoT and Networking products.
Services include package design and development, wafer probe and package test, wafer bumping and redistribution, package assembly and final test. Engineering services offer best-in-class thermal, electrical and mechanical modeling and characterization as well as design automation. Test engineering services range from test program development to full product characterization of packaged RF, mixed signal, logic and memory devices.
Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the US.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
FormFactor is a leading provider of essential test and measurement technologies along the full IC life cycle – from metrology and inspection, characterization, modeling, reliability, and design debug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge.
FormFactor’s leading-edge probe stations, probes, probe cards, optical metrology and inspection, advanced thermal subsystems and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing of high-speed and high-density semiconductor chips.
FormFactor serves customers in Asia, Europe, and North America.
Nidec SV TCL is a global provider of high-quality semiconductor testing solutions. Our extensive product line includes innovative MEMS Probes and a variety of Probe Card technologies. Our proprietary MEMS Probes are fully customizable, capable of both wafer/final test, and can be utilized for many advanced devices including RF, 5G, Mobile, Auto & IoT. We also have analytical and simulation capabilities along with full turnkey services for probe cards and final test.
Our unmatched worldwide infrastructure provides coverage for major semiconductor regions around the world with full design & manufacturing capabilities for our probe technologies in China, USA, Taiwan, Japan, Korea & Singapore.
Contact us at email@example.com to learn more!