March 15 & 16, 2022 – Online
Heterogeneous Integration (HI) of multiple semiconductor dies of different designs in a single advance package to increase functionality provides significant challenges to assembly and test today. As the concept of “Chiplets” – integrating an even larger number of die each smaller than a complete ‘standalone’ semiconductor device in a single package– gains traction these challenges will become even harder.
We will discuss the best-known methods (BKM) of Heterogeneous Integration Testability at Road to Chiplets – Heterogeneous Integration Testability.