Chiplets - Data & Test
Data sharing and analysis of test results and other production ‘signals’ are critical enabling technologies to make Chiplet-based advanced packaging practical. The concept of “Chiplets” - integrating multiple die (smaller than a complete semiconductor device) using advanced packaging to provide greater functionality than a single monolithic die – has firmly captured the attention of the semiconductor industry. To transition such devices from design of experiments and prototypes to commercial reality will require cross-functional data sharing across factories and suppliers. New data sources including new test steps and new ways of analyzing and sharing data are essential.
After a very successful inaugural event (Road to Chiplets – Architecture) with nearly 700 registrants, MEPTEC will explore the new types of data and tests required to make products using a Chiplet approach practical at Road to Chiplets – Data & Test.
Road Chiplets - Data Test on November 9 - 11, 2021
Authors on November 11th 2021 to be announced
|Tuesday||November 9, 2021||8:00 - 11:00 am PDT|
|Wednesday||November 10, 2021||8:00 - 11:00 am PDT|
|Thursday||November 11, 2021||8:00 - 11:00 am PDT|
Confirmed Speakers Include
Tuesday November 9, 2021
Scalable Chiplet Interface -
Where We are What We Need
Intel Test Architect / CHIPS Alliance
Wednesday November 10, 2021
Debug and Fault Isolation Strategy as Industry moves to 3D Heterogeneous Products
Test and Repair Challenges in 3D stacking of Chiplets
Amkor Technology is one of the world’s largest providers of high-quality semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s broad package portfolio offers our customers semiconductor solutions to enable 5G, AI, Automotive, Communications, Computing, Consumer, Industrial, IoT and Networking products.
Services include package design and development, wafer probe and package test, wafer bumping and redistribution, package assembly and final test. Engineering services offer best-in-class thermal, electrical and mechanical modeling and characterization as well as design automation. Test engineering services range from test program development to full product characterization of packaged RF, mixed signal, logic and memory devices.
Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the US.