Road to Chiplets – Data & Test




Chiplets - Data & Test

Event Description


Data sharing and analysis of test results and other production ‘signals’ are critical enabling technologies to make Chiplet-based advanced packaging practical. The concept of “Chiplets” - integrating multiple die (smaller than a complete semiconductor device) using advanced packaging to provide greater functionality than a single monolithic die – has firmly captured the attention of the semiconductor industry. To transition such devices from design of experiments and prototypes to commercial reality will require cross-functional data sharing across factories and suppliers. New data sources including new test steps and new ways of analyzing and sharing data are essential.

After a very successful inaugural event (Road to Chiplets – Architecture) with nearly 700 registrants, MEPTEC will explore the new types of data and tests required to make products using a Chiplet approach practical at Road to Chiplets – Data & Test.

Road Chiplets - Data Test on  November 9 - 11, 2021

Authors on November 11th 2021 to be announced


Register Here

For more information download the pdf below

Held as two online sessions
Tuesday November 9, 2021 8:00 - 11:00 am PDT
Wednesday November 10, 2021 8:00 - 11:00 am PDT
Thursday November 11, 2021 8:00 - 11:00 am PDT

Confirmed Speakers Include

Tuesday November 9, 2021



 
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Scalable Chiplet Interface -
Where We are What We Need


Adam Wright
Intel Test Architect / CHIPS Alliance

 
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DFT for 3D IC - Challenges and Solutions

Wu Yang
Siemens EDA
 
Adam Cron
Fungible DFT: from Chiplets to Chips

Adam Cron
Synopsys
 
Jawad Nasrullah
Design of Heterogeneous Integrated Circuits - Testing Considerations

Jawad Nasrullah

Wednesday November 10, 2021



 
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Debug and Fault Isolation Strategy as Industry moves to 3D Heterogeneous Products


Terrence Tan
Intel

 
Ken Butler
The Road to Chiplets is Paved with Data

Ken Butler
Advantest
 
Guy Cortez
Using Data Analytics to Debug and Trace Multi-Chip Module (MCM) Test Failures during Manufacturing Process and Reducing Overall Test and Manufacturing Costs

Guy Cortez
Synopsys
 
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Test and Repair Challenges in 3D stacking of Chiplets

Sreejit Chakaravarty
Intel

Sponsor Directory

Please thank our sponsors who have made this event possible!


Diamond Sponsor


Amkor Logo

Amkor Technology is one of the world’s largest providers of high-quality semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s broad package portfolio offers our customers semiconductor solutions to enable 5G, AI, Automotive, Communications, Computing, Consumer, Industrial, IoT and Networking products.

Services include package design and development, wafer probe and package test, wafer bumping and redistribution, package assembly and final test. Engineering services offer best-in-class thermal, electrical and mechanical modeling and characterization as well as design automation. Test engineering services range from test program development to full product characterization of packaged RF, mixed signal, logic and memory devices.

Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the US.



Emerald Sponsors


Advantest logo
Advantest is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, artificial intelligence (AI), machine learning, smart medical devices and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also conducts R&D to address emerging testing challenges, produces multi-vision metrology scanning electron microscopes essential to photomask manufacturing, and offers groundbreaking 3D imaging and analysis tools. Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility.