Chiplets - Data & Test
Data sharing and analysis of test results and other production ‘signals’ are critical enabling technologies to make Chiplet-based advanced packaging practical. The concept of “Chiplets” - integrating multiple die (smaller than a complete semiconductor device) using advanced packaging to provide greater functionality than a single monolithic die – has firmly captured the attention of the semiconductor industry. To transition such devices from design of experiments and prototypes to commercial reality will require cross-functional data sharing across factories and suppliers. New data sources including new test steps and new ways of analyzing and sharing data are essential.
After a very successful inaugural event (Road to Chiplets – Architecture) with nearly 700 registrants, MEPTEC will explore the new types of data and tests required to make products using a Chiplet approach practical at Road to Chiplets – Data & Test.
Road Chiplets - Data Test on November 9 - 11, 2021
|Tuesday||November 9, 2021||8:00 - 11:00 am PDT|
|Wednesday||November 10, 2021||8:00 - 11:00 am PDT|
|Thursday||November 11, 2021||8:00 - 11:00 am PDT|
Confirmed Speakers Include
Tuesday November 9, 2021
Wednesday November 10, 2021
Thursday November 11, 2021
Amkor Technology is one of the world’s largest providers of high-quality semiconductor packaging and test services.
Our broad package portfolio offers customers semiconductor and test solutions to enable 5G, AI, Automotive, Communications, Computing, Consumer, Industrial, IoT and Networking products. Services include package engineering, design and development as well as wafer probe, bumping and redistribution as well as package assembly. Test engineering services range from test program development to full product characterization of packaged RF, mixed signal, logic and memory devices.
Amkor’s flexible supply chain includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the US.
Synopsys technology is at the heart of innovations that are changing the way we live and work. The internet of things. Autonomous cars. Wearables. Smart medical devices. Secure financial services. Machine learning and computer vision. These breakthroughs are ushering in an era of Smart, Secure Everything―where devices are getting smarter, everything’s connected, and everything must be secure.
Everything―where devices are getting smarter, everything’s connected, and everything must be secure. Powering this new era are advanced semiconductors. These remarkable devices contain multiple chips, chiplets, memory subsystems and many special-purpose processors, integrated with 2.5/3D technology and running highly advanced AI-powered software. Synopsys makes Smart, Secure Everything possible with the world’s most advanced tools for multi-chip, multi-technology, three-dimensional design, verification, IP integration, and application security testing. Our technology helps customers innovate from silicon to software, so they can deliver Smart, Secure Everything.
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TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. Our latest report is: Quantifying the Impact of Heterogeneous Integration: Chiplets and SiP. TechSearch International professionals have an extensive network of more than 18,000 contacts in North America, Asia, and Europe.
For more information, contact TechSearch at tel: 512-372-8887 or see www.techsearchinc.com. Follow us on twitter @Jan_TechSearch and on LinkedIn.