Road to Chiplets – Data & Test

Chiplets - Data & Test

Event Description

Data sharing and analysis of test results and other production ‘signals’ are critical enabling technologies to make Chiplet-based advanced packaging practical. The concept of “Chiplets” - integrating multiple die (smaller than a complete semiconductor device) using advanced packaging to provide greater functionality than a single monolithic die – has firmly captured the attention of the semiconductor industry. To transition such devices from design of experiments and prototypes to commercial reality will require cross-functional data sharing across factories and suppliers. New data sources including new test steps and new ways of analyzing and sharing data are essential.

After a very successful inaugural event (Road to Chiplets – Architecture) with nearly 700 registrants, MEPTEC will explore the new types of data and tests required to make products using a Chiplet approach practical at Road to Chiplets – Data & Test.

Road Chiplets - Data Test on  November 9 - 11, 2021

Authors on November 11th 2021 to be announced

Register Here

For more information download the pdf below

Held as three online sessions
Tuesday November 9, 2021 8:00 - 11:00 am PDT
Wednesday November 10, 2021 8:00 - 11:00 am PDT
Thursday November 11, 2021 8:00 - 11:00 am PDT

Confirmed Speakers Include

Tuesday November 9, 2021

Adam Wright
Scalable Chiplet Interface Testing –
Where We are and
What We Need

Adam Wright
Intel Test Architect / CHIPS Alliance

DFT for 3D IC - Challenges and Solutions

Wu Yang
Siemens EDA
Adam Cron
Fungible DFT: from Chiplets to Chips

Adam Cron
Jawad Nasrullah
Design of Heterogeneous Integrated Circuits - Testing Considerations

Jawad Nasrullah
Palo Alto Electron Inc.
Chip-lets Interconnect Test Challenges

Sreejit Chakaravarty

Terrence Tan
Debug and Fault Isolation Strategy as Industry moves to 3D Heterogeneous Products

Terrence Tan

Sergio Mier
Machine Learning in Semiconductors - A Balanced Approach

Sergio Mier
Ken Butler
The Road to Chiplets is Paved with Data

Ken Butler
George Harris
Test Impact of Chiplets in Packages

George Harris
Guy Cortez
Using Data Analytics to Debug and Trace Multi-Chip Module (MCM) Test Failures during Manufacturing Process and Reducing Overall Test and Manufacturing Costs

Guy Cortez

Lifetime performance and health monitoring of high bandwidth, die-to-die interfaces using chip telemetry

Nir Sever

Kimon Michaels
Leveraging semiconductor lifecycle data to drive closed-loop and cost-efficient chiplet quality testing

Kimon Michaels
PDF Solutions
Michael Schuldenfrei
Quantifiable Assurance Hub – A Practical Approach to Trusted and Assured Microelectronics across the Supply Chain

Michael Schuldenfrei
Optimal+/National Instruments
Vinay Srihari
Cross-domain sharing of data and business logic with governance controls in the Snowflake Data Cloud

Vinay Srihari

Sponsor Directory

Please thank our sponsors who have made this event possible!

Diamond Sponsor

Amkor Logo

Amkor Technology is one of the world’s largest providers of high-quality semiconductor packaging and test services.

Our broad package portfolio offers customers semiconductor and test solutions to enable 5G, AI, Automotive, Communications, Computing, Consumer, Industrial, IoT and Networking products. Services include package engineering, design and development as well as wafer probe, bumping and redistribution as well as package assembly. Test engineering services range from test program development to full product characterization of packaged RF, mixed signal, logic and memory devices.

Amkor’s flexible supply chain includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the US.

Amkor Tester Gif

Emerald Sponsors

Advantest logo
Advantest is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, artificial intelligence (AI), machine learning, smart medical devices and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also conducts R&D to address emerging testing challenges, produces multi-vision metrology scanning electron microscopes essential to photomask manufacturing, and offers groundbreaking 3D imaging and analysis tools. Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility.
Synopsys logo

Synopsys technology is at the heart of innovations that are changing the way we live and work. The internet of things. Autonomous cars. Wearables. Smart medical devices. Secure financial services. Machine learning and computer vision. These breakthroughs are ushering in an era of Smart, Secure Everything―where devices are getting smarter, everything’s connected, and everything must be secure.

Everything―where devices are getting smarter, everything’s connected, and everything must be secure. Powering this new era are advanced semiconductors. These remarkable devices contain multiple chips, chiplets, memory subsystems and many special-purpose processors, integrated with 2.5/3D technology and running highly advanced AI-powered software. Synopsys makes Smart, Secure Everything possible with the world’s most advanced tools for multi-chip, multi-technology, three-dimensional design, verification, IP integration, and application security testing. Our technology helps customers innovate from silicon to software, so they can deliver Smart, Secure Everything.

We give wings to designers to innovate, iterate, and productize their dreams to change the world.

Ruby Sponsors

Synopsys logo

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. Our latest report is: Quantifying the Impact of Heterogeneous Integration: Chiplets and SiP. TechSearch International professionals have an extensive network of more than 18,000 contacts in North America, Asia, and Europe.

For more information, contact TechSearch at tel: 512-372-8887 or see Follow us on twitter @Jan_TechSearch and on LinkedIn.