April 4 & 5, 2023
8-11 am Pacific
Today advanced semiconductor packaging is already delivering Heterogeneous Integration (HI) by enabling the mix-n-matching of integrated circuits (typically known good die) in the same package to deliver higher performance. However, HI also includes the concept of assembling elements beyond integrated circuits, such as optical elements or various sensors including micro-electromechanical systems (MEMS), in devices and products.
The largest challenges discussed to date have been focused on the integrated circuits. This workshop will explore the challenge associated with everything other than the chips which are pulled together to make today’s leading-edge heterogeneous integrations a reality.
Not Just Chips will examine the cross-functional design, packaging, and test challenges and opportunities of integrating and interconnecting elements with silicon chips in packages and products. Areas of current research and commercialization of interest include:
- advanced interconnects
- micro-electromechanical systems (MEMS)
- co-packaged optics
- functional fabrics
Since this is a non-exhausted list - if a technology is “integrated” with a chip within a package or product, it is of interest for presentation.
Microelectronics Packaging and Test Engineering Council (MEPTEC ) is hosting the Not Just Chips virtual event workshop to cross-functionally discuss these challenges on April 4 & 5, 2023 starting at 8 am Pacific. We are seeking participation via technical presentations from commercial and academic domains. We are also soliciting event sponsors to support the event to make registration free for everyone.
Please submit your presentation abstract (150 to 250 words) to Rosina Haberl (rosina @ meptec.org) no later than January 27, 2023. Or contact Rosina for additional information.