May 10 – 12, 2022 – Online
The semiconductor industry has come a long way from the days where the semiconductor die design / layout team simply passed the device off to another team to “handle” the packaging. Now there are packaging Design Integration (DI) teams who are responsible for “co-designing” the packaging and other processing while the chip is being designed. These teams resolve interdependencies, develop test vehicles, and manage risk to make sure there is a viable product.
As part of the MEPTEC Road to Chiplets series, we will discuss the role and challenges of DI in the upcoming storm of Chiplets. Properly implementing and developing methodologies to manage DI is essential to make Chiplets commercially viable.