Chiplets Architecture 2021


Road to Chiplets - Architecture

The concept of “Chiplets” - integrating multiple die smaller than complete “stand alone” semiconductor devices using advanced packaging – has firmly captured the attention of the semiconductor industry. The foundational technologies to enable this advanced packaging have been explored in detailed at industry events. MEPTEC through a series of events will cover the practical aspects of designing, implementing (packaging), and testing Chiplets as this cross-functional knowledge is critical to transitioning such devices from science projects to commercial reality.

Road to Chiplets – Architecture will focus on the high-level decisions that need to be made to implement a product using a Chiplet approach.

Join us at Road to Chiplets - Architecture on  July 13 - 14, 2021


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Event registration is free courtesy of our sponsors


Held as two online sessions
Tuesday July 13, 2021 8:00 - 11:00 am PDT
Wednesday July 14, 2021 8:00 - 11:00 am PDT

Confirmed Speakers Include

Tuesday July 13, 2021



 
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Why Chiplets?


Jan Vardaman
Techsearch International

 
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Data Infrastructure and Chiplets

Sandeep Bharathi
Marvell
 
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Road to Chiplets and the Next 1000X

Ming Zhang
Synopsys
 
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Test Challenges & Directions as the Industry moves to 3D Heterogeneous Products

Phil Nigh
Broadcom
 
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Pathfinding and Design of Large-Scale Chiplet-Based Systems

Puneet Gupta
UCLA
 
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Chiplets: Building Blocks and Future Packaging Trends

Dave Hiner
Amkor

Wednesday July 14, 2021



 
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Chiplets – It takes an HIR Village

Bill Chen
ASE
 
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Design of Heterogeneous Integrated Circuits–Chiplets, Modeling, and Data Exchange


Jawad Nasrullah

 
Bapi Vinnakota
The Open Domain-Specific Architecture: A Status Update

Bapi Vinnakota
Open Compute Project/Broadcom
 
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Chiplet Architectural Considerations for Adoption and Scaling

Robert Munoz
Intel
 
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Are current approaches to reliability assurance going to be adequate in the era of chiplets and heterogeneous integration?

Abhijit Dasgupta
University of Maryland

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Event registration is free courtesy of our sponsors


Program subject to change without notice.

Sponsor Directory

Please thank our sponsors who have made this event possible!


Emerald Sponsors


Advantest logo
Advantest is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, artificial intelligence (AI), machine learning, smart medical devices and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also conducts R&D to address emerging testing challenges, produces multi-vision metrology scanning electron microscopes essential to photomask manufacturing, and offers groundbreaking 3D imaging and analysis tools. Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility.

Advantest logo
Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the USA. For more information, visit www.amkor.com.

Synopsys logo

Synopsys technology is at the heart of innovations that are changing the way we live and work. The internet of things. Autonomous cars. Wearables. Smart medical devices. Secure financial services. Machine learning and computer vision. These breakthroughs are ushering in an era of Smart, Secure Everything―where devices are getting smarter, everything’s connected, and everything must be secure.

Everything―where devices are getting smarter, everything’s connected, and everything must be secure. Powering this new era are advanced semiconductors. These remarkable devices contain multiple chips, chiplets, memory subsystems and many special-purpose processors, integrated with 2.5/3D technology and running highly advanced AI-powered software. Synopsys makes Smart, Secure Everything possible with the world’s most advanced tools for multi-chip, multi-technology, three-dimensional design, verification, IP integration, and application security testing. Our technology helps customers innovate from silicon to software, so they can deliver Smart, Secure Everything.

We give wings to designers to innovate, iterate, and productize their dreams to change the world.