As the electronic content and complexity increases in all types of products - from computers to smartphones to medical devices to automobiles - it is essential to have a secure supply chain. The safety and security of these products rely directly on the semiconductor devices inside performing exactly as designed. Beyond functional and reliability testing, what are the cross-functional issues facing packaging, test, and design engineers to ensure what is delivered contains the properly functioning original design and nothing more?
In today’s world of advanced packaging including heterogenous integration with “chiplets” and complex system-in-packages (SiP), there are many more opportunities for errors or intentional changes by ‘bad actors’. Verification of manufacturing correctness is complicated by the use of intellectual property (IP) libraries that have physical designs and test vectors obscured. Chiplets are often treated as ‘black boxes’ providing architectural advantages while creating additional verification issues.
Join this free virtual workshop to cross-functionally discuss these challenges on April 28 and 29, 2021. Hear technical presentations and learn from experts in the commercial, military, and academic domains about Supply Chain Security.
|Wednesday||April 28, 2021||8:00 - 11:00 am PDT|
|Thursday||April 29, 2021||8:00 - 11:00 am PDT|
Wednesday April 28, 20218:00 - 11:00am PDT
Thursday April 29, 20218:00 - 11:00am PDT
Program subject to change without notice.
Amkor Technology is one of the world’s largest providers of high-quality semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s broad package portfolio offers our customers semiconductor solutions to enable 5G, AI, Automotive, Communications, Computing, Consumer, Industrial, IoT and Networking products.
Services include package design and development, wafer probe and package test, wafer bumping and redistribution, package assembly and final test. Engineering services offer best-in-class thermal, electrical and mechanical modeling and characterization as well as design automation. Test engineering services range from test program development to full product characterization of packaged RF, mixed signal, logic and memory devices.
Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the US.
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